Method for manufacturing multi-layered unit for multi-layered ceramic electronic component

ABSTRACT

It is an object of the present invention is to provide a method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component which can prevent a ceramic green sheet from being deformed and destroyed and prevent a solvent contained in an electrode paste from sinking into a ceramic green sheet, thereby enabling manufacture of a multi-layered unit including a ceramic green sheet and an electrode layer laminated to each other in a desired manner. The method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component according to the present invention includes a step of forming a ceramic green sheet on the surface of a first carrier film, a step of forming a release layer on the surface of a second carrier film including a surface-treated region on which a surface treatment is performed for improving releasability and non-surface-treated regions on which no surface treatment is performed on both sides of the surface-treated region and having a width substantially equal to that of the first carrier film, a step of forming an electrode layer in a predetermined pattern and a spacer layer in a complementary pattern to that of the electrode layer on the surface of the release layer, thereby forming an inner electrode layer, a step of forming an adhesive layer on the surface of a third carrier film having a width substantially equal to that of the second carrier film, a step of transferring the adhesive layer formed on the third carrier film onto the surface of the inner electrode layer, and a step of transferring the ceramic green sheet formed on the surface of the first carrier film onto the adhesive layer transferred on the surface of the inner electrode layer formed on the surface of the second carrier film, thereby fabricating a multi-layered unit including the ceramic green sheet and the inner electrode layer laminated onto each other, wherein the adhesive layer is formed by coating the surface of the third carrier film with an adhesive agent solution so that the width of the adhesive layer is narrower than the width of the third carrier film by at least 2α where α is a positive value, wider than the width of the ceramic green sheet formed on the surface of the first carrier film and the widths of the release layer and the inner electrode layer formed on the surface of the second carrier film by at least 2α and wider than the width of the surface-treated region of the second carrier film by at least 2α.

BACKGROUND OF THE INVENTION

The present invention relates to a method for manufacturing amulti-layered unit for a multi-layered electronic component, andparticularly to a method for manufacturing the multi-layered unit for amulti-layered ceramic electronic component which can prevent a ceramicgreen sheet from being deformed and destroyed and prevent a solventcontained in an electrode paste from sinking into a ceramic green sheet,thereby enabling manufacture of a multi-layered unit including a ceramicgreen sheet and an electrode layer laminated to each other in a desiredmanner.

DESCRIPTION OF THE PRIOR ART

Recently, the need to downsize various electronic devices makes itnecessary to downsize the electronic components incorporated in thedevices and improve the performance thereof. Also in multi-layeredceramic electronic components, such as multi-layered ceramic capacitors,it is strongly required to increase the number of layers and make thelaminated unit thinner.

When a multi-layered ceramic electronic component as typified by amulti-layered ceramic capacitor is to be manufactured, ceramic powders,a binder such as an acrylic resin, a butyral resin or the like, aplasticizer such as a phthalate ester, glycol, adipate ester, phosphateester or the like, and an organic solvent such as toluene, methyl ethylketone, acetone or the like are mixed and dispersed, thereby preparing adielectric paste.

The dielectric paste is then applied onto a carrier film made ofpolyethylene terephthalate (PET), polypropylene (PP) or the like usingan extrusion coater, a gravure coater or the like to form a coatinglayer and the coating layer is heated to dryness, thereby fabricating aceramic green sheet.

Further, an electrode paste such as of nickel is printed onto theceramic green sheet in a predetermined pattern using a screen printerand is dried to form an electrode layer.

When the electrode layer has been formed, the ceramic green sheet onwhich the electrode layer is formed is peeled off from the carrier filmto form a multi-layered unit including the ceramic green sheet and theelectrode layer. Then, a ceramic green chip is formed by laminating adesired number of the multi-layered units to form the laminated body,pressing the laminated body and dicing the laminated body.

Finally, the binder is removed from the green chip, the green chip isbaked and an external electrode is formed, thereby completing amulti-layered ceramic electronic component such as a multi-layeredceramic capacitor.

At present, the need to downsize electronic components and improve theperformance thereof makes it necessary to set the thickness of theceramic green sheet determining the spacing between layers of amulti-layered ceramic capacitor to be equal to or smaller than 3 μm or 2μm and to laminate three hundred or more multi-layered units eachincluding a ceramic green sheet and an electrode layer.

However, in the case of printing an electrode paste for an internalelectrode onto a ceramic green sheet, thereby forming an electrodelayer, there arise problems of a solvent contained in the electrodepaste dissolving or swelling a binder component contained in the ceramicgreen sheet and of the electrode paste sinking into the ceramic greensheet, thereby causing short circuit failure.

Therefore, Japanese Patent Application Laid Open No. 63-51616 andJapanese Patent Application Laid Open No. 3-250612 propose a methodincluding steps of printing a paste for an internal electrode patternonto another carrier film to form an electrode layer, drying theelectrode layer and thermally transferring the thus dried electrodelayer onto the surface of a ceramic green sheet.

However, in this method, it is difficult to peel off the carrier filmfrom the electrode layer transferred onto the surface of the ceramicgreen sheet.

Further, in this method, in order to thermally transfer and bond thedried electrode layer onto the surface of the ceramic green sheet, it isnecessary to apply a high pressure onto the ceramic green sheet and theelectrode layer at a high temperature and therefore, the ceramic greensheet and the electrode layer tend to be deformed and are sometimespartially destroyed.

SUMMARY OF THE INVENTION

It is therefore an object of the present invention to provide a methodfor manufacturing a multi-layered unit for a multi-layered ceramicelectronic component which can prevent a ceramic green sheet from beingdeformed and destroyed and prevent a solvent contained in an electrodepaste from sinking into a ceramic green sheet, thereby enablingmanufacture of a multi-layered unit including a ceramic green sheet andan electrode layer laminated to each other in a desired manner.

The above object of the present invention can be accomplished by amethod for manufacturing a multi-layered unit for a multi-layeredceramic electronic component comprising a step of forming a ceramicgreen sheet on the surface of a first carrier film, a step of forming arelease layer on the surface of a second carrier film including asurface-treated region on which a surface treatment is performed forimproving releasability and non-surface-treated regions on which nosurface treatment is performed on both sides of the surface-treatedregion and having a width substantially equal to that of the firstcarrier film, a step of forming an electrode layer in a predeterminedpattern and a spacer layer in a complementary pattern to that of theelectrode layer on the surface of the release layer, thereby forming aninner electrode layer, a step of forming an adhesive layer on thesurface of a third carrier film having a width substantially equal tothat of the second carrier film, a step of bringing the surface of theadhesive layer formed on the third carrier film and the surface of theinner electrode layer into close contact with each other and pressingthem, thereby bonding the adhesive layer onto the surface of the innerelectrode layer, a step of peeling off the third carrier film from theadhesive layer, a step of pressing and bonding the ceramic green sheetformed on the surface of the first carrier film and the inner electrodelayer formed on the surface of the second carrier film onto each othervia the adhesive layer, and a step of peeling off the first carrier filmfrom the ceramic green sheet, thereby fabricating a multi-layered unitincluding the ceramic green sheet and the inner electrode layerlaminated onto each other, wherein the adhesive layer is formed bycoating the surface of the third carrier film with an adhesive agentsolution so that the width of the adhesive layer is narrower than thewidth of the third carrier film by at least 2a where α is a positivevalue, wider than the width of the ceramic green sheet formed on thesurface of the first carrier film and the widths of the release layerand the inner electrode layer formed on the surface of the secondcarrier film by at least 2α and wider than the width of thesurface-treated region of the second carrier film by at least 2α.

According to the present invention, since the ceramic green sheet istransferred onto the surface of the inner electrode layer via theadhesive layer bonded onto the surface of the inner electrode layer, itis possible to transfer the ceramic green sheet onto the surface of theinner electrode layer including the electrode layer and the spacer layerwith a low pressure and it is therefore possible to manufacture amulti-layered unit including the ceramic green sheet, the electrodelayer and the spacer layer while reliably preventing the ceramic greensheet from being deformed and destroyed.

Further, according to the present invention, since the inner electrodelayer including the electrode layer and the spacer layer is bonded ontothe surface of the ceramic green sheet via the adhesive layer after theinner electrode layer was formed on the surface of the second carrierfilm and dried, it is possible to reliably prevent a solvent containedin an electrode paste from dissolving and swelling a binder componentcontained in the ceramic green sheet and simultaneously prevent theelectrode paste from sinking into the ceramic green sheet, therebymanufacturing a multi-layered unit including the ceramic green sheet,the electrode layer and the spacer layer.

Furthermore, according to the present invention, since the adhesivelayer is transferred onto the surface of the inner electrode layerincluding the electrode layer and the spacer layer after the adhesivelayer was formed on the surface of the third carrier film and dried, itis possible to reliably prevent the adhesive agent solution from sinkinginto the electrode layer and the spacer layer and manufacture amulti-layered unit including the ceramic green sheet, the electrodelayer and the spacer layer.

Moreover, according to the present invention, since the adhesive layeris transferred onto the surface of the inner electrode layer includingthe electrode layer and the spacer layer after the adhesive layer wasformed on the surface of the third carrier film and dried and the innerelectrode layer and the ceramic green sheet are bonded via the adhesivelayer, it is possible to reliably prevent the adhesive agent solutionfrom sinking into the ceramic green sheet and manufacture amulti-layered unit including the ceramic green sheet, the electrodelayer and the spacer layer.

Further, in the case of laminating a number of multi-layered units eachincluding an electrode layer printed in a predetermined pattern on aceramic green sheet, since a step is formed between the surface of theelectrode layer and the surface of the ceramic green sheet where noelectrode layer is formed, a laminated body fabricated by laminating anumber of multi-layered units is often deformed and delamination oflayers sometimes occurs. However, according to the present invention,since the spacer layer is formed on the surface of the release layer ina complementary pattern to that of the electrode layer, it is possibleto effectively prevent a laminated body fabricated by laminating anumber of multi-layered units each including the thus formed spacerlayer from being deformed and effectively prevent delamination of layersfrom occurring.

Furthermore, the multi-layered unit is fabricated by coating the surfaceof a first carrier film continuously conveyed with a dielectric paste toform a ceramic green sheet, coating the surface of a second carrier filmcontinuously conveyed with a dielectric paste to form a release layer,printing the surface of the release layer formed on the second carrierfilm continuously conveyed with an electrode paste and a dielectricpaste to form an inner electrode layer, coating the surface of a thirdcarrier film continuously conveyed with an adhesive agent solution toform an adhesive layer, bringing the surface of the inner electrodelayer formed on the second carrier film and the surface of the adhesivelayer formed on the third carrier film into contact with each other andpressing them, thereby bonding the adhesive layer onto the surface ofinner electrode layer and peeling off the third carrier film from theadhesive layer while the second carrier film and the third carrier filmare being continuously conveyed, and bringing the surface of the ceramicgreen sheet formed on the first carrier film and the surface of theinner electrode layer formed on the second carrier film into contactwith each other via the adhesive layer and pressing them, while thefirst carrier film and the second carrier film are being continuouslyconveyed, thereby bonding the ceramic green sheet and the innerelectrode layer onto each other via the adhesive layer.

However, in the case where the long first carrier film, the long secondcarrier film and the long third carrier film are conveyed using a sheetconveying mechanism, it is impossible to completely prevent the firstcarrier film, the second carrier film and the third carrier film frommeandering and it is unavoidable for the first carrier film, the secondcarrier film and the third carrier film to meander within a range of αwhere α is positive value inherent to the sheet conveying mechanism.Therefore, in the case where the surface of the first carrier film iscoated with a dielectric paste to form a ceramic green sheet and thesurface of the second carrier film with the adhesive agent solution toform an adhesive layer so that the width of the ceramic green sheet andthe width of the adhesive layer are equal to each other, when theceramic green sheet and the inner electrode layer are bonded onto eachother via the adhesive layer, the ceramic green sheet is sometimespresent outside of the adhesive layer in a widthwise direction, when thefirst carrier film is peeled off from the ceramic green sheet. In such acase, portions of the ceramic green sheet which are not bonded to theadhesive layer are often removed together with the first carrier film sothat the process is contaminated by the thus removed ceramic greensheet.

On the other hand, in the case where the adhesive layer is presentoutside of the ceramic green sheet in a widthwise direction when theceramic green sheet and the inner electrode layer are boded to eachother via the adhesive layer, the adhesive layer is sometimes bondedonto the first carrier film and removed together with the first carrierfilm when the first carrier film is peeled off from the ceramic greensheet and the ceramic green sheet is further removed together with thefirst carrier film.

However, according to the present invention, since the adhesive layer isformed by coating the surface of the third carrier film with an adhesiveagent solution so that the width thereof is wider than the width of theceramic green sheet formed on the surface of the first carrier film andthe widths of the release layer and the inner electrode layer formed onthe surface of the second carrier film by at least 2α and wider than thewidth of the surface-treated region of the second carrier film by atleast 2α, when the adhesive layer formed on the third carrier film istransferred onto the surface of the inner electrode layer formed on thesecond carrier film while the second carrier film and the third carrierfilm are being conveyed continuously, even if the second carrier filmand/or the third carrier film meanders within a range of α, the adhesivelayer is reliably bonded onto the surface of the non-surface-treatedregions of the second carrier film on which no surface treatment forimproving releasability of the second carrier film is performed.Therefore, when the ceramic green sheet and the inner electrode layerare bonded onto each other via the adhesive layer while the firstcarrier film and the second carrier film are being conveyedcontinuously, even if the first carrier film and/or the second carrierfilm meanders within a range of α and the adhesive layer is bonded ontothe first carrier film, it is possible to reliably prevent the adhesivelayer from being removed together with the first carrier film when thefirst carrier film is peeled off from the ceramic green sheet.

Moreover, according to the present invention, since the adhesive layeris present outside of the ceramic green sheet whenever the ceramic greensheet and the inner electrode layer are bonded onto each other via theadhesive layer and the entire surface of the ceramic green sheet isbonded onto the adhesive layer, it is possible to reliably prevent theceramic green sheet from being removed together with the first carrierfilm when the first carrier film is peeled off from the ceramic greensheet.

Further, in the case where an adhesive layer is formed by coating thesurface of a third carrier film with an adhesive agent solution so thatthe width of the adhesive layer is equal to that of the third carrierfilm, when the adhesive layer is transferred onto the surface of theinner electrode layer formed on the surface of the second carrier film,the adhesive layer is sometimes present outside of the second carrierfilm due to meandering of the second carrier film and/or the thirdcarrier film. In such a case, the adhesive layer is bonded onto atransfer roller, whereby the adhesive layer cannot be transferred ontothe surface of the inner electrode layer and, in addition, the transferroller is contaminated.

However, according to the present invention, since the adhesive layer isformed by coating the surface of the third carrier film with theadhesive agent solution so that the width of the adhesive layer isnarrower than the width of the third carrier film by at least 2α where αis a positive value, when the adhesive layer is transferred onto thesurface of the inner electrode layer formed on the surface of the secondcarrier film, even if the second carrier film and/or the third carrierfilm meanders, it is possible to reliably bond the adhesive layer ontothe surface of the inner electrode layer and it is therefore possible toreliably prevent the adhesive layer from being bonded onto the surfaceof a transfer roller.

In a preferred aspect of the present invention, the inner electrodelayer is formed by printing the surface of the second carrier film withan electrode paste and a dielectric paste so that the width of the innerelectrode layer is wider than that of the surface-treated region by atleast 2α.

According to this preferred aspect of the present invention, since theinner electrode layer is formed by printing the surface of the secondcarrier film with an electrode paste and a dielectric paste so that thewidth of the inner electrode layer is wider than that of thesurface-treated region by at least 2α, the inner electrode layer issecurely bonded onto the non-surface-treated regions on which no surfacetreatment for improving the releasability of the second carrier film isperformed and it is therefore possible to reliably keep the innerelectrode layer bonded to the surface of the second carrier film whenthe first carrier film is peeled off from the ceramic green sheet.

In a further preferred aspect of the present invention, the releaselayer is formed by coating the surface of the second carrier film with adielectric paste so that the width of the release layer is wider thanthat of the surface-treated region by at least 2α and the innerelectrode layer is formed by printing the surface of the second carrierfilm with an electrode paste and a dielectric paste so that the width ofthe inner electrode layer is wider than that of the release layer by atleast 2α.

According to this preferred aspect of the present invention, since therelease layer is formed by coating the surface of the second carrierfilm with a dielectric paste so that the width of the release layer iswider than that of the surface-treated region by at least 2α and theinner electrode layer is formed by printing the surface of the secondcarrier film with an electrode paste and a dielectric paste so that thewidth of the inner electrode layer is wider than that of the releaselayer by at least 2α, the release layer is securely bonded onto thesurface of the non-surface treated regions on which no surface treatmentfor improving the releasability of the second carrier film is performedand the inner electrode layer is securely bonded onto the surface of thenon-surface treated regions on which no surface treatment for improvingthe releasability of the second carrier film is performed. It istherefore possible to reliably keep the inner electrode layer and therelease layer bonded to the surface of the second carrier film when thefirst carrier film is peeled off from the ceramic green sheet.

In a further preferred aspect of the present invention, slit processingis performed on the first carrier film, the ceramic green sheet, theadhesive layer, the inner electrode layer, the release layer and thethird carrier film in the surface-treated region inside of a region onwhich the release layer is to be formed by coating the surface of thesecond carrier film with the dielectric paste.

According to this preferred aspect of the present invention, since slitprocessing is performed on the first carrier film, the ceramic greensheet, the adhesive layer, the inner electrode layer, the release layerand the third carrier film in the surface-treated region inside of aregion on which the release layer is to be formed by coating the surfaceof the second carrier film with the dielectric paste, even in the casewhere the coating width of the ceramic green sheet, the coating width ofthe adhesive layer, the coating width of the release layer and theprinting width of the inner electrode layer are set differently forpreventing the ceramic green sheet and the adhesive layer from beingremoved together with the first carrier film when the first carrier filmis peeled off from the ceramic green sheet, it is possible tomanufacture a multi-layered unit in which the inner electrode layer andthe release layer having the same widths are laminated by cutting off atportions on which the slit processing is performed on the ceramic greensheet, the adhesive layer, the inner electrode layer and the releaselayer located outside of the portions on which the slit processing isperformed.

In a further preferred aspect of the present invention, surfacetreatment is performed on the surface of the first carrier film forimproving the releasability thereof and the ceramic green sheet isformed on a region on which the surface treatment is performed.

According to this preferred aspect of the present invention, sincesurface treatment is performed on the surface of the first carrier filmfor improving the releasability thereof and the ceramic green sheet isformed on a region on which the surface treatment is performed, it ispossible to peel off the first carrier film from the ceramic green sheetin a desired manner.

In the present invention, the dielectric paste used for forming theceramic green sheet is normally prepared by kneading a dielectric rawmaterial and an organic vehicle obtained by dissolving a binder into anorganic solvent.

The dielectric raw material can be selected from among various compoundscapable of forming a composite oxide or oxide, such as a carbonate,nitrate, hydroxide, organic metallic compound and the like and mixturesthereof. The dielectric raw material is normally used in the form of apowder whose average particle diameter is about 0.1 μm to about 3.0 μm.The particle diameter of the dielectric raw material is preferablysmaller than the thickness of the ceramic green sheet.

The binder used for preparing the organic vehicle is not particularlylimited and various known binders such as ethylcellulose, polyvinylbutyral, acrylic resin can be used as the binder for preparing theorganic vehicle. However, in order to make the ceramic green sheetthinner, a butyral system resin such as polyvinyl butyral is preferablyemployed.

The organic solvent used for preparing the organic vehicle is notparticularly limited and terpineol, butyl carbitol, acetone, toluene andthe like can be used as the organic solvent used for preparing theorganic vehicle.

In the present invention, the dielectric paste may be prepared bykneading the dielectric raw material and a vehicle prepared bydissolving a water soluble binder therein.

The water soluble binder used for preparing the dielectric paste is notparticularly limited and polyvinyl alcohol, methylcellulose,hydroxyethylcellulose, water soluble acrylic resin, emulsion and thelike may be used as the water soluble binder.

The amounts of the respective constituents contained in the dielectricpaste are not particularly limited and the dielectric paste may beprepared so as to contain about 1 weight % to about 5 weight % of abinder and about 10 weight % to about 50 weight % of a solvent, forexample.

As occasion demands, the dielectric paste may contain additives selectedfrom among various dispersing agents, plasticizers, dielectricmaterials, accessory ingredient compounds, glass frits, insulatingmaterials and the like. In the case of adding these additives to thedielectric paste, it is preferable to set the total content to be equalto or less than about 10 weight %. In the case where a butyral systemresin is employed as the binder resin, it is preferable to set thecontent of the plasticizer to be about 25 weight parts to about 100weight parts with respect to 100 weight parts of the binder. When thecontent of the plasticizer is too small, the ceramic green sheet tendsto become brittle and on the other hand, when the content of theplasticizer is too large, the plasticizer oozes out and the ceramicgreen sheet becomes hard to handle.

In the present invention, a ceramic green sheet is fabricated byapplying the dielectric paste onto the surface of a first carrier filmto form a coating layer and drying the coating layer.

In the present invention, the ceramic green sheet is preferably formedby coating the surface of the first carrier film with the dielectricpaste in such a manner that the width of the ceramic green sheet- isnarrower than that of the first carrier film by at least 2α and theceramic green sheet is more preferably formed by coating the surface ofthe first carrier film with the dielectric paste in such a manner thatthe width of the ceramic green sheet is the same as that of an innerelectrode layer described later.

Here, a is defined as the maximum width within which one side of a sheetmay meander when the sheet is conveyed by a sheet conveying mechanismand a value inherent to the sheet conveying mechanism.

Therefore, the value of a depends upon the sheet conveying mechanism forconveying the sheet but is normally about 1 mm to about 2 mm.

The first carrier film normally has a width of about 100 mm to about 400mm.

The dielectric paste is applied onto the first carrier film using anextrusion coater or wire bar coater, thereby forming a coating layer.

As the first carrier film, a polyethylene terephthalate is employed, forexample, and the surface of the first carrier film is coated with asilicon resin, an alkyd resin or the like in order to improve thereleasability thereof. The thickness of the first carrier film is notparticularly limited but it is preferable for the first carrier film tohave a thickness of about 5 μm to about 100 μm.

The thus formed coating layer is dried at a temperature of about 50° C.to about 100° C. for about 1 to about 20 minutes, whereby a ceramicgreen sheet is formed on the first carrier film.

In the present invention, the thickness of the ceramic green sheet afterdrying is preferably equal to or thinner than 3 μm and more preferablyequal to or thinner than 1.5 μm.

In the present invention, an electrode layer and a spacer layer areprinted on a second carrier film using a printing machine such as ascreen printing machine, a gravure printing machine or the like.

As the second carrier film, a polyethylene terephthalate sheet isemployed, for example, and the surface of the second carrier film iscoated with a silicon resin, an alkyd resin or the like in order toimprove the releasability thereof, thereby forming a surface-treatedregion thereon. In the present invention, non-surface-treated regions onwhich no surface treatment for improving the releasability of the secondcarrier film is performed are formed on the surface of the secondcarrier film on both sides of the surface-treated region on whichsurface treatment for improving the releasability of the second supportis performed.

The width of the second carrier film is substantially the same as thatof the first carrier film.

In the present invention, prior to forming an electrode layer and aspacer layer on the second carrier film, a dielectric paste is firstprepared and applied onto the second carrier film, whereby a releaselayer is formed on the second carrier film.

The dielectric paste for forming the release layer preferably containsdielectric particles having the same composition as that of dielectricparticles contained in the ceramic green sheet.

The dielectric paste for forming the release layer contains, in additionto the dielectric particles, a binder, and, optionally, a plasticizerand a release agent. The size of the dielectric particles may be thesame as that of the dielectric particles contained in the ceramic greensheet but is preferably smaller than that of the dielectric particlescontained in the ceramic green sheet.

Illustrative examples of binders usable for forming the release layerinclude acrylic resin, polyvinyl butyral, polyvinyl acetal, polyvinylalcohol, polyolefin, polyurethane, polystyrene, copolymer thereof, andemulsion thereof.

The binder contained in the dielectric paste for forming the releaselayer may or may not belong to the same binder group as that the bindercontained in the ceramic green sheet belongs to but it preferablybelongs to the same binder group as that the binder contained in theceramic green sheet belongs to.

The binder contained in dielectric paste for forming the release layercontains the binder preferably in an amount of about 2.5 weight % toabout 200 weight % with respect to 100 weight parts of the dielectricparticles, more preferably in an amount of about 5 weight parts to about30 weight parts, most preferably in an amount of about 8 weight parts toabout 30 weight parts.

The plasticizer contained in the dielectric paste for forming therelease layer is not particularly limited and illustrative examplesthereof include phthalate ester, adipic acid, phosphate ester, glycolsand the like. The plasticizer contained in the dielectric paste forforming the release layer may or may not belong to the same plasticizergroup as that the plasticizer contained in the ceramic green sheetbelongs to.

The dielectric paste for forming the release layer contains theplasticizer preferably in an amount of about 0 weight % to about 200weight % with respect to 100 weight parts of the binder, more preferablyin an amount of about 20 weight parts to about 200 weight parts, mostpreferably in an amount of about 50 weight parts to about 100 weightparts.

The releasing agent contained in the dielectric paste for forming therelease layer is not particularly limited and illustrative examplesthereof include paraffin, wax, silicone oil and the like.

The dielectric paste for forming the release layer contains thereleasing agent preferably in an amount of about 0 weight % to about 100weight % with respect to 100 weight parts of the binder, more preferablyin an amount of about 2 weight parts to about 50 weight parts, mostpreferably in an amount of about 5 weight parts to about 20 weightparts.

In the present invention, it is preferable for the content ratio of thebinder to the dielectric material contained in the release layer to besubstantially equal to or lower than the content ratio of the binder tothe dielectric material contained in the ceramic green sheet. Further,it is preferable for the content ratio of the plasticizer to thedielectric material contained in the release layer to be substantiallyequal to or higher than the content ratio of the plasticizer to thedielectric material contained in the ceramic green sheet. Moreover, itis preferable for the content ratio of the releasing agent to thedielectric material contained in the release layer to be higher than thecontent ratio of the releasing agent to the dielectric materialcontained in the ceramic green sheet.

In the case where the release layer having the above describedcomposition is formed, even if the ceramic green sheet is very thin, thestrength of the release layer can be lower than the breaking strength ofthe ceramic green sheet and it is therefore possible to reliably preventthe ceramic green sheet from being destroyed when the second carrierfilm is peeled off from the release layer.

The release layer is formed by applying the dielectric paste onto thesecond carrier film using a wire bar coater or the like.

In the present invention, the release layer is preferably formed bycoating the surface of the second carrier film with the dielectric pasteso that the width of the release layer is narrower than that of thesecond carrier film by at least 2α and wider than that of thesurface-treated region by at least 4α.

In the present invention, more preferably, the release layer is formedby coating the surface of the second carrier film with the dielectricpaste so that the width of the release layer is narrower than that ofthe second carrier film by at least 4α and wider than that of thesurface-treated region by at least 4α.

The thickness of the release layer is preferably equal to or thinnerthan that of an electrode layer to be formed thereon, more preferablyequal to or thinner than about 60% of the electrode layer thickness andmost preferably equal to or thinner than about 30% of the electrodelayer thickness.

After the release layer has been formed, it is dried at a temperature ofabout 50° C. to about 100° C. for about 1 to about 10 minutes.

After the release layer has been dried, an electrode layer is formed onthe surface of the release layer in a predetermined pattern.

In the present invention, the electrode paste usable for forming theelectrode layer is prepared by kneading a conductive material containingany of various conductive metals or alloys, any of various oxides whichwill form a conductive material containing any of various conductivemetals or alloys after baking, an organic metal compound, resinate orthe like, and an organic vehicle prepared by dissolving a binder in anorganic solvent.

As the conductive material used for preparing the electrode paste, Ni,Ni alloy or the mixture thereof is preferably used. The shape of theconductive material is not particularly limited. The conductive materialparticles may have a spherical shape or a scale-like shape, or theconductive material may contain spherical conductive material particlesand scale-like conductive material particles. The average particlediameter of the conductive material is not particularly limited but aconductive material having an average particle diameter of about 0.1 μmto about 2 μm is normally used for preparing the electrode paste and theconductive material having an average particle diameter of about 0.2 μmto about 1 μm is preferably used for preparing the electrode paste.

The binder for preparing the organic vehicle is not particularlylimited. ethylcellulose, acrylic resin, polyvinyl butyral, polyvinylacetal, polyvinyl alcohol, polyolefin, polyurethane, polystyrene and thecopolymer thereof can be used for preparing the organic vehicle andamong these, a butyral system such as polyvinyl butyral is particularlypreferable for preparing the organic vehicle.

The electrode paste preferably contains the binder in an amount about2.5 weight parts to about 20 weight parts with respect to 100 weightparts of the conductive material.

As the solvent, a known solvent such as terpineol, butyl carbitol orkerosene can be used. The content of the solvent is preferably about 20weight % to about 55 weight % with respect to the weight of theelectrode paste.

In order to improve adhesion property, it is preferable for theelectrode paste to contain a plasticizer.

The plasticizer contained in the electrode paste is not particularlylimited and illustrative examples thereof include phthalate ester suchas benzyl butyl phthalate (BBP), adipic acid, phosphate ester, glycolsand the like. The electrode paste contains the plasticizer preferably inan amount of about 10 weight % to about 300 weight % with respect to 100weight parts of the binder, more preferably in an amount of about 10weight parts to about 200 weight parts.

In the case where the amount of the plasticizer added to the electrodepaste is too large, the strength of the electrode layer tends to bemarkedly lower.

The electrode layer is formed by printing the surface of the releaselayer formed on the second carrier film with the electrode paste using ascreen printing machine or a gravure printing machine.

It is preferable to form the electrode layer so as to have a thicknessof about 0.1 μm to about 5 μm and it is more preferable to form theelectrode layer so as to have a thickness of about 0.1 μm to about 1.5μm.

A dielectric paste is further printed on the surface of the releaselayer formed on the second carrier film where no electrode layer isformed using a screen printing machine or a gravure printing machine ina complementary pattern to that of the electrode layer, thereby forminga spacer layer.

It is possible to form the spacer layer on the surface of the releaselayer formed on the second carrier film in a complementary pattern tothat of the electrode layer prior to forming the electrode layer.

In the present invention, the dielectric paste used for forming thespacer layer is prepared in a similar manner to that for preparing thedielectric paste for the ceramic green sheet.

The dielectric paste used for forming the spacer layer preferablycontains dielectric particles having the same composition as that of thedielectric particles contained in the ceramic green sheet.

The dielectric paste used for forming the spacer layer preferablycontains, in addition to the dielectric particles, a binder, and,optionally, a plasticizer and a release agent. The size of thedielectric particles may be the same as that of the dielectric particlescontained in the ceramic green sheet but is preferably smaller than thatof the dielectric particles contained in the ceramic green sheet.

Illustrative examples of binders usable for forming the spacer layerinclude acrylic resin, polyvinyl butyral, polyvinyl acetal, polyvinylalcohol, polyolefin, polyurethane, polystyrene, copolymer thereof, andemulsion thereof.

The binder contained in dielectric paste for forming the spacer layermay or may not belong to the same binder group as that the bindercontained in the ceramic green sheet belongs to but it preferablybelongs to the same binder group as that the binder contained in theceramic green sheet belongs to.

The binder contained in dielectric paste for forming the spacer layercontains the binder preferably in an amount of about 2.5 weight % toabout 200 weight % with respect to 100 weight parts of the dielectricparticles, more preferably in an amount of about 4 weight parts to about15 weight parts, most preferably in an amount of about 6 weight parts toabout 10 weight parts.

The plasticizer contained in the dielectric paste for forming the spacerlayer is not particularly limited and illustrative examples thereofinclude phthalate ester, adipic acid, phosphate ester, glycols and thelike. The plasticizer contained in the dielectric paste for forming therelease layer may or may not belong to the same plasticizer group asthat the plasticizer contained in the ceramic green sheet belongs to.

The dielectric paste for forming the spacer layer contains theplasticizer preferably in an amount of about 0 weight % to about 200weight % with respect to 100 weight parts of the binder, more preferablyin an amount of about 20 weight parts to about 200 weight parts, mostpreferably in an amount of about 50 weight parts to about 100 weightparts.

The releasing agent contained in the dielectric paste for forming thespacer layer is not particularly limited and illustrative examplesthereof include paraffin, wax, silicone oil and the like.

The dielectric paste for forming the spacer layer contains the releasingagent preferably in an amount of about 0 weight % to about 100 weight %with respect to 100 weight parts of the binder, more preferably in anamount of about 2 weight parts to about 50 weight parts, most preferablyin an amount of about 5 weight parts to about 20 weight parts.

In the present invention, an inner electrode layer is constituted by theelectrode layer and the spacer layer.

In the present invention, the inner electrode layer including theelectrode layer and the spacer layer is preferably formed by coating thesurface of the second support surface with the electrode paste and thedielectric paste so that the width of the inner electrode layer isnarrower than that of the second carrier film by at least 2α and widerthan that of the surface-treated region by at least 2α and the innerelectrode layer is more preferably formed by coating the surface of thesecond support surface with the electrode paste and the dielectric pasteso that the width of the inner electrode layer is wider than that of therelease layer by at least 2α.

In the present invention, it is particularly preferable to form theinner electrode layer by coating the surface of the second supportsurface with the electrode paste and the dielectric paste so that thewidth of the inner electrode layer is substantially the same as that ofthe ceramic green sheet.

Further, in the present invention, it is preferable to form theelectrode layer and the spacer layer so that ts/te is equal to or largerthan 0.7 and equal to or smaller than 1.2, where ts is the thickness ofthe spacer layer and te is the thickness of the electrode layer. It ismore preferable to form them so that ts/te is equal to or larger than0.8 and equal to or smaller than 1.2 and it is most preferable to formthem so that ts/te is equal to or larger than 0.9 and equal to orsmaller than 1.2.

The electrode layer and the spacer layer are dried at a temperature ofabout 70° C. to about 120° C. for about 5 to about 15 minutes. Thedrying conditions of the electrode layer and the spacer layer are notparticularly limited.

The ceramic green sheet, and the electrode layer and the spacer layerare bonded via an adhesive layer and a third carrier film is prepared inorder to form an adhesive layer.

As the third carrier film, a polyethylene terephthalate is employed, forexample, and the surface of the third carrier film is coated with asilicon resin, an alkyd resin or the like in order to improve thereleasability thereof. The thickness of the third carrier film is notparticularly limited but it is preferable for the third carrier film tohave a thickness of about 5 μm to about 100 μm.

In the present invention, the third carrier film has substantially thesame width as that of the second carrier film and therefore, hassubstantially the same width as that of the first carrier film.

The adhesive layer is formed by coating the third carrier film with anadhesive agent solution.

In the present invention, the adhesive agent solution contains a binder,and, optionally, a plasticizer, a release agent and an antistatic agent.

The adhesive agent solution may contain dielectric particles having thesame composition as that of dielectric particles contained in theceramic green sheet. In the case where the adhesive agent solutioncontains dielectric particles, it is preferable for the ratio of theweight of the dielectric particles to the weight of the binder to beless than the ratio of the weight of the dielectric particles containedin the ceramic green sheet to the weight of the binder.

The binder contained in the adhesive agent solution preferably belongsto the same binder group as that the binder contained in the ceramicgreen sheet belongs to but it is not absolutely necessary for it tobelong to the same binder group as that the binder contained in theceramic green sheet belongs to.

The plasticizer contained in the adhesive agent solution preferablybelongs to the same plasticizer group as that the plasticizer containedin the dielectric paste for forming the ceramic green sheet belongs tobut it is not absolutely necessary for it to belong to the sameplasticizer group as that the plasticizer contained in the dielectricpaste for forming the ceramic green sheet belongs to.

The content of the plasticizer is preferably about 0 weight % to about200 weight % with respect to 100 weight parts of the binder, morepreferably about 20 weight parts to about 200 weight parts, and mostpreferably about 50 weight parts to about 100 weight parts.

In the present invention, the adhesive agent solution preferablycontains an antistatic agent in an amount of 0.01 weight % to 15 weight% of the binder and more preferably contains an antistatic agent in anamount of 0.01 weight % to 10 weight % of the binder.

In the present invention, the antistatic agent contained in the adhesiveagent solution is not particularly limited insofar as it is an organicsolvent having a hygroscopic property and illustrative examples of theantistatic agent contained in the adhesive agent solution includeethylene glycol, polyethylene glycol, 2-3 butanediol, glycerin. anampholytic surfactant such as an imidazoline system surfactant, apolyalkylene glycol derivative system surfactant and a carboxylic acidamidine salt system surfactant, and the like.

Among these, an ampholytic surfactant such as an imidazoline systemsurfactant, a polyalkylene glycol derivative system surfactant or acarboxylic acid amidine salt system surfactant is preferable since asmall amount thereof can prevent static charge from being generated andenable peel-off of the third carrier film from the adhesive layer with asmall releasing force, and an imidazoline system surfactant isparticularly preferable since it enables peel-off the third carrier filmfrom the adhesive layer with a very small releasing force.

The adhesive agent solution is applied onto the third carrier film usinga bar coater, an extrusion coater, a reverse coater, a dip coater, akiss coater or the like, thereby forming the adhesive layer so as topreferably have a thickness of about 0.02 μm to about 0.3 μm, morepreferably have a thickness of about 0.02 μm to about 0.1 μm. In thecase where the thickness of the adhesive layer is thinner than about0.02 μm, the adhesion force is lowered and on the other hand, in thecase where the thickness of the adhesive layer exceeds about 0.3 μm,defects (empty spaces) tend to be generated.

In the present invention, the adhesive layer is formed by coating thesurface of the third carrier film with the adhesive agent solution sothat the width of the adhesive layer is narrower than that of the thirdcarrier film by at least 2α where α is a positive value, wider than thewidth of the ceramic green sheet formed on the surface of the firstcarrier film and the widths of the release layer and the inner electrodelayer formed on the surface of the second carrier film by at least 2αand wider than the width of the surface-treated region of the secondcarrier film by at least 2α.

The adhesive layer is dried at a temperature between room temperature(25° C.) and about 80° C. for about 1 to about 5 minutes, for example.The drying conditions of the adhesive layer are not particularlylimited.

The adhesive layer formed on the third carrier film is transferred ontothe surfaces of the electrode layer and the spacer layer formed on thesecond carrier film.

When the adhesive layer is to be transferred, it is kept in contact withthe surfaces of the electrode layer and the spacer layer formed on thesecond carrier film, and the adhesive layer, the electrode layer andspacer layer are pressed at a temperature of about 40° C. to about 100°C. under a pressure of about 0.2 MPa to about 15 MPa, preferably under apressure of 0.2 MPa to about 6 MPa, whereby the adhesive layer is bondedonto the surface of the electrode layer and the spacer layer. Afterward,the third carrier film is peeled off from the adhesive layer.

When the adhesive layer is to be transferred onto the electrode layerand the spacer layer, the second carrier film formed with the electrodelayer and the spacer layer and the third carrier film formed with theadhesive layer may be pressed onto each other using a pressing machineor using a pair of pressure rollers but it is preferable to press thesecond carrier film and the third carrier film onto each other using apair of pressure rollers.

Then, the ceramic green sheet and the electrode and spacer layers arebonded to each other via the adhesive layer.

The ceramic green sheet and the electrode and spacer layers are pressedat a temperature of about 40° C. to about 100° C. under a pressure ofabout 0.2 MPa to about 15 MPa, preferably under a pressure of 0.2 MPa toabout 6 MPa, whereby the ceramic green sheet is bonded onto theelectrode layer and spacer layer via the adhesive layer.

Preferably, the ceramic green sheet, the adhesive layer, and theelectrode and spacer layers are pressed onto each other using a pair ofpressure rollers and the ceramic green sheet and the electrode andspacer layers are bonded to each other via the adhesive layer.

When the ceramic green sheet and the electrode and spacer layers havebeen bonded to each other via the adhesive layer, the first carrier filmis peeled off from the ceramic green sheet.

Then, an adhesive layer is transferred onto the surface of the ceramicgreen sheet similarly to the case of transferring the adhesive layerformed on the surface of the third carrier film onto the surface of theelectrode layer and the spacer layer.

A laminated body is thus obtained and is cut to a predetermined size,thereby fabricating a multi-layered unit including the release layer,the electrode layer, the spacer layer, the adhesive layer, the ceramicgreen sheet and the adhesive layer laminated on the second carrier filmin this order.

A number of the thus fabricated multi-layered units are laminated,thereby fabricating a multi-layered block.

When a number of the multi-layered units are to be laminated, a basesubstrate is first fixed onto a substrate and the multi-layered unit ispositioned in such a manner that the adhesive layer formed on theceramic green sheet comes into close contact with the surface of thebase substrate and a pressure is applied onto the multi-layered unit.

As the base substrate, a polyethylene terephthalate film is employed,for example.

The thickness of the base substrate is not particularly limited insofaras it can support the multi-layered unit.

When the adhesive layer formed on the ceramic green sheet has beenbonded onto the surface of the base substrate, the second carrier filmis peeled off from the release layer.

Further, a new multi-layered unit is positioned so that an adhesivelayer formed on a ceramic green sheet thereof comes into close contactwith the release layer of the multi-layered unit bonded onto the basesubstrate and pressed toward the substrate, thereby laminating the newmulti-layered unit on the multi-layered unit bonded onto the basesubstrate.

Then, the second carrier film of the newly laminated multi-layered unitis peeled off from the release layer thereof.

Similarly to the above, a predetermined number of multi-layered blocksare laminated, thereby fabricating a multi-layered block and apredetermined number of the multi-layered blocks are laminated, wherebya multi-layered ceramic electronic component is manufactured.

The above and other objects and features of the present invention willbecome apparent from the following description made with reference tothe accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic cross-sectional view showing how a ceramic greensheet is formed on a first carrier film.

FIG. 2 is a schematic cross-sectional view showing a second carrier filmformed with a release layer on the surface thereof.

FIG. 3 is a schematic cross-sectional view showing a second carrier filmformed with an electrode layer and a spacer layer on the surface of arelease layer.

FIG. 4 is a schematic cross-sectional view showing an adhesive layersheet obtained by forming an adhesive layer on the surface of a thirdcarrier film.

FIG. 5 is a schematic cross-sectional view showing a preferredembodiment of an adhering and peeling apparatus for bonding an adhesivelayer formed on a third carrier film onto the surface of an innerelectrode layer including an electrode layer and a spacer layer andformed on a second carrier film and peeling off the third carrier filmfrom the adhesive layer.

FIG. 6 is a schematic partial cross-sectional view showing how anadhesive layer is bonded onto the surface of an inner electrode layerincluding an electrode layer and a spacer layer and formed on a secondcarrier film and a third carrier film is peeled off from the adhesivelayer.

FIG. 7 is a schematic cross-sectional view showing a preferredembodiment of an adhering apparatus for bonding an electrode layer and aspacer layer onto the surface of a ceramic green sheet via an adhesivelayer.

FIG. 8 is a schematic partial cross-sectional view showing how slitprocessing is performed on a laminated body obtained by bonding aceramic green sheet and an inner electrode layer via an adhesive layerand including a first carrier film, the ceramic green sheet, theadhesive layer, the inner electrode layer, a release layer and a secondcarrier film.

FIG. 9 is a schematic cross-sectional view showing a multi-layered unitobtained by laminating a release layer, an electrode layer, a spacerlayer, an adhesive layer, a ceramic green sheet and an adhesive layer ona second carrier film.

FIG. 10 is a schematic partial cross-sectional view showing a first stepof a lamination process of multi-layered units.

FIG. 11 is a schematic partial cross-sectional view showing a secondstep of a lamination process of multi-layered units.

FIG. 12 is a schematic partial cross-sectional view showing a third stepof a lamination process of multi-layered units.

FIG. 13 is a schematic partial cross-sectional view showing a fourthstep of a lamination process of multi-layered units.

FIG. 14 is a schematic partial cross-sectional view showing a fifth stepof a lamination process of multi-layered units.

FIG. 15 is a schematic partial cross-sectional view showing a first stepof a lamination process of for laminating a multi-layered blocklaminated on a carrier film fixed to a substrate on a cover layer of amulti-layered ceramic capacitor.

FIG. 16 is a schematic partial cross-sectional view showing a secondstep of a lamination process of for laminating a multi-layered blocklaminated on a carrier film fixed to a substrate on a cover layer of amulti-layered ceramic capacitor.

FIG. 17 is a schematic partial cross-sectional view showing a third stepof a lamination process of for laminating a multi-layered blocklaminated on a carrier film fixed to a substrate on a cover layer of amulti-layered ceramic capacitor.

FIG. 18 is a schematic partial cross-sectional view showing a fourthstep of a lamination process of for laminating a multi-layered blocklaminated on a carrier film fixed to a substrate on a cover layer of amulti-layered ceramic capacitor.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

A method for manufacturing a multi-layered ceramic capacitor which is apreferred embodiment of the present invention will now be described withreference to accompanying drawings.

When a multi-layered ceramic capacitor is to be manufactured, adielectric paste is first prepared in order to fabricate a ceramic greensheet.

The dielectric paste is normally prepared by kneading a dielectric rawmaterial and an organic vehicle obtained by dissolving a binder into anorganic solvent.

The resultant dielectric paste is applied onto a first carrier filmusing an extrusion coater or wire bar coater, thereby forming a coatinglayer.

As the first carrier film, a polyethylene terephthalate sheet isemployed, for example, and the surface of the first carrier film iscoated with a silicon resin, an alkyd resin or the like in order toimprove the releasability thereof. The thickness of the first carrierfilm is not particularly limited but it is preferable for the firstcarrier film to have a thickness of about 5 μm to about 100 μm.

The thus formed coating layer is dried at a temperature of about 50° C.to about 100° C. for about 1 to about 20 minutes, whereby a ceramicgreen sheet is formed on the first carrier film.

The thickness of the ceramic green sheet after drying is preferablyequal to or thinner than 3 μm and more preferably equal to or thinnerthan 1.5 μm.

In this embodiment, the ceramic green sheet 2 is formed by coating thesurface of the first carrier film with the dielectric paste in such amanner that the width of the ceramic green sheet is narrower than thatof the first carrier film by at least 4α and substantially the same asthat of an inner electrode layer including an electrode layer and aspacer layer described later.

Here, α is defined as the maximum width within which one side of a sheetmay meander when the sheet is conveyed by a sheet conveying mechanismand a value inherent to the sheet conveying mechanism. In other words,in this embodiment, a sheet conveying mechanism for conveying the firstcarrier film is controlled so that meandering of the first carrier filmstays within a range of α when the first carrier film is continuouslyconveyed.

The value of α depends upon the sheet conveying mechanism for conveyingthe sheet but is normally about 1 mm to about 2 mm.

The first carrier film normally has a width of about 100 mm to about 400mm.

FIG. 1 is a schematic cross-sectional view showing how the ceramic greensheet is formed on the first carrier film.

Actually, the first carrier film 1 is long and the ceramic green sheet 2is continuously formed on the long first carrier film 1.

On other hand, a second carrier film is prepared independently of thefirst carrier film 1 formed with the ceramic green sheet 2 and a releaselayer, an electrode layer and a spacer layer are formed on the secondcarrier film.

FIG. 2 is a schematic partial cross-sectional view showing a secondcarrier film 4 formed with a release layer 5 on the surface thereof.

Actually, the second carrier film 4 is long and the release layer 5 iscontinuously formed on the surface of the second carrier film 4 and theelectrode layer 6 is formed on the surface of the release layer 5 in apredetermined pattern.

In this embodiment, the second carrier film 4 has substantially the samewidth ad that of the first carrier film 1.

As the second carrier film 4, a polyethylene terephthalate sheet isemployed, for example. The thickness of the second carrier film 4 is notparticularly limited and may be the same as or different from that ofthe first carrier film 1 on which the ceramic green sheet 2 is formedbut it is preferable for the second carrier film 4 to have a thicknessof about 5 μm to about 100 μm.

In this embodiment, as shown in FIG. 2, the surface of the secondcarrier film 4 is formed with a surface-treated region 4 a coated with asilicon resin, an alkyd resin or the like in order to improve thereleasability of the second carrier film and non-surface-treated regions4 b on which no surface treatment for improving the releasability of thesecond carrier film is performed on both sides of the surface-treatedregion 4 a.

When the release layer 5 is to be formed on surface of the secondcarrier film 4, a dielectric paste for forming the release layer 5 isprepared in a similar manner to that for forming the ceramic green sheet2.

A dielectric paste for forming the release layer 5 preferably containsdielectric particles having the same composition as that of dielectricparticles contained in the ceramic green sheet 2.

The binder contained in the dielectric paste for forming the releaselayer 5 may or may not belong to the same binder group as that thebinder contained in the ceramic green sheet 2 belongs to but itpreferably belongs to the same binder group as that the binder containedin the ceramic green sheet 2 belongs to.

When the dielectric paste has been prepared in this manner, the surfaceof the second carrier film 4 is coated with the dielectric paste using awire bar coater (not shown), thereby forming the release layer 5.

In this embodiment, as shown in FIG. 2, the release layer is formed bycoating the surface of the second carrier film 4 with the dielectricpaste so that the width of the release layer is narrower than the thatof the second carrier film 4 by 6α and wider than that of thesurface-treated region 4 a by 2α.

Here, α is defined as the maximum width within which one side of a sheetmay meander when the sheet is conveyed by a sheet conveying mechanismand a value inherent to the sheet conveying mechanism. In other words,in this embodiment, the sheet conveying mechanism for conveying thesecond carrier film 4 is controlled so that meandering of the secondcarrier film 4 stays within a range of a when the second carrier film 4is continuously conveyed.

FIG. 2 show an ideal case where the release layer could be formed whilesuppressing the meandering width a of the second carrier film 4 to zero.

The thickness of the release layer 5 is preferably equal to or thinnerthan that of an electrode layer 6 to be formed thereon, more preferablyequal to or thinner than about 60% of the electrode layer thickness andmost preferably equal to or thinner than about 30% of the electrodelayer thickness.

After the release layer 5 has been formed, the release layer 5 is driedat a temperature of about 50° C. to about 100° C. for about 1 to about10 minutes.

After the release layer 5 has been dried, an electrode layer 6 whichwill form an inner electrode layer after baking is formed on the surfaceof the release layer 5 in a predetermined pattern and a spacer layer isfurther formed on the surface of the release layer 5 where no electrodelayer 6 is formed in a complementary pattern to that of the electrodelayer 6.

FIG. 3 is a schematic cross-sectional view showing how the electrodelayer 6 and the spacer layer 7 are formed on the surface of the releaselayer 5.

When the electrode layer 6 is to be formed on the release layer 5 formedon the second carrier film 4, an electrode paste is first prepared bykneading a conductive material containing any of various conductivemetals or alloys, any of various oxides which will form a conductivematerial containing any of various conductive metals or alloys afterbaking, an organic metal compound, resinate or the like, and an organicvehicle prepared by dissolving a binder in an organic solvent.

As the conductive material used for preparing the electrode paste, Ni,Ni alloy or a mixture thereof is preferably used.

The average particle diameter of the conductive material is notparticularly limited but a conductive material having an averageparticle diameter of about 0.1 μm to about 2 μm is normally used forpreparing the electrode paste and a conductive material having anaverage particle diameter of about 0.2 μm to about 1 μm is preferablyused for preparing the electrode paste.

The electrode layer 6 is formed by printing the surface of the releaselayer formed on the second carrier film with the electrode paste onusing a screen printing machine or a gravure printing machine.

It is preferable to form the electrode layer 6 so as to have a thicknessof about 0.1 μm to about 5 μm and it is more preferable to form theelectrode layer so as to have a thickness of about 0.1 μm to about 1.5μm.

After forming the electrode layer 6 having the predetermined pattern onthe surface of the release layer 5 using a screen printing process or agravure printing process, a spacer layer is formed on the surface of therelease layer 5 where no electrode layer 6 is formed in a complementarypattern to that of the electrode layer 6.

The spacer layer 7 can be formed on regions of the release layer 5 otherthan regions where the electrode layer 6 will be formed prior to formingthe electrode layer 6 on the surface of the release layer 5.

When the spacer layer 7 is to be formed, a dielectric paste having asimilar composition to that of the dielectric paste used for forming theceramic green sheet is prepared and a screen printing process or agravure printing process is used to print the dielectric paste on thesurface of the release layer 5 where no electrode layer 6 is formed in acomplementary pattern to that of the electrode layer 6.

An inner electrode layer 8 is formed by the electrode layer 6 and thespacer layer 7. In this embodiment, as shown in FIG. 3, the innerelectrode layer 8 is formed by printing the electrode paste and thedielectric paste onto the surface of the second carrier film 4 so thatthe width of the inner electrode layer 8 is narrower than that of thesecond carrier film 4 by 4α, wider than that of the release layer 5 by2α and substantially the same as that of the ceramic green sheet 2.

Therefore, portions of the inner electrode layer 8 in the vicinity ofopposite side edges thereof are formed on the non-surface-treatedregions 4 b on which no surface treatment for improving thereleasability of the second carrier film 4 is performed.

FIG. 2 shows an ideal case where the inner electrode layer 8 could beformed while suppressing the meandering width α of the second carrierfilm 4 to zero.

In this embodiment, the spacer layer 7 is formed on the release layer 5so that ts/te is equal to 1.1, where ts is the thickness of the spacerlayer 7 and te is the thickness of the electrode layer 6.

In this embodiment, the ceramic green sheet 2, and the electrode layer 6and the spacer layer 7 are bonded via an adhesive layer and a thirdcarrier film is further prepared independently of the first carrier film1 on which the ceramic green sheet 2 is formed and the second carrierfilm 4 on which the electrode layer 6 and the spacer layer 7 are formedand an adhesive layer is formed on the third carrier film, therebyfabricating an adhesive layer sheet.

FIG. 4 is a schematic partial cross-sectional view showing the adhesivelayer sheet in which an adhesive layer is formed on the surface of athird carrier film.

Actually, the third carrier film 9 is long and the adhesive layer 10 iscontinuously formed on the long third carrier film 9.

In this embodiment, the third carrier film 9 has substantially the samewidth as that of the second carrier film 4 and therefore, hassubstantially the same width as that of the first carrier film 1.

As the third carrier film 9, a polyethylene terephthalate sheet isemployed, for example, and the surface of the third carrier film 9 iscoated with a silicon resin, an alkyd resin or the like in order toimprove the releasability thereof. The thickness of the third carrierfilm 9 is not particularly limited but it is preferable for the thirdcarrier film 9 to have a thickness of about 5 μm to about 100 μm.

When the adhesive layer 10 is to be formed, an adhesive agent solutionis first prepared.

In this embodiment, the adhesive agent solution contains a binder, and,optionally, a plasticizer, a release agent and an antistatic agent.

The adhesive agent solution may contain dielectric particles having thesame composition as that of dielectric particles contained in theceramic green sheet. In the case where the adhesive agent solutioncontains dielectric particles, it is preferable for the ratio of theweight of the dielectric particles to the weight of the binder to beless than the ratio of the weight of the dielectric particles containedin the ceramic green sheet to the weight of the binder.

The binder contained in the adhesive agent solution preferably belongsto the same binder group as that the binder contained in the ceramicgreen sheet belongs to but it is not absolutely necessary for it tobelong to the same binder group as that the binder contained in theceramic green sheet belongs to.

The plasticizer contained in the adhesive agent solution preferablybelongs to the same plasticizer group as that the plasticizer containedin the dielectric paste for forming the ceramic green sheet belongs tobut it is not absolutely necessary for it to belong to the sameplasticizer group as that the plasticizer contained in the dielectricpaste for forming the ceramic green sheet belongs to.

The content of the plasticizer is preferably about 0 weight % to about200 weight % with respect to 100 weight parts of the binder, morepreferably about 20 weight parts to about 200 weight parts, and mostpreferably about 50 weight parts to about 100 weight parts.

In this embodiment, the adhesive agent solution contains an antistaticagent in an amount of 0.01 weight % to 15 weight % of the binder.

In this embodiment, as the antistatic agent, an imidazoline systemsurfactant is employed.

The thus prepared adhesive agent solution is applied onto the thirdcarrier film 9 using a bar coater, an extrusion coater, a reversecoater, a dip coater, a kiss coater or the like, thereby forming theadhesive layer 10 so as to preferably have a thickness of about 0.02 μmto about 0.3 μm, more preferably have a thickness of about 0.02 μm toabout 0.1 μm. In the case where the thickness of the adhesive layer 10is thinner than about 0.02 μm, the adhesion force is lowered and, on theother hand, in the case where the thickness of the adhesive layer 10exceeds about 0.3 μm, defects (empty spaces) tend to be generated.

In this embodiment, the adhesive layer 10 is formed by coating thesurface of the third carrier film 9 with the adhesive agent solution sothat the width of the adhesive layer 10 is narrower than that of thethird carrier film 9 by 2α, wider than the width of the ceramic greensheet 2 formed on the surface of the first carrier film 1 and the widthsof the release layer 5 and the inner electrode layer 8 formed on thesurface of the second carrier film 4 by 2α and wider than that of thesurface-treated region 4 a of the second carrier film 4 by 2α.

Here, α is defined as the maximum width within which one side of a sheetmay meander when the sheet is conveyed by a sheet conveying mechanismand a value inherent to the sheet conveying mechanism. In other words,in this embodiment, the sheet conveying mechanism for conveying thethird carrier film 9 is controlled so that meandering of the thirdcarrier film 9 stays within a range of a when the third carrier film 9is continuously conveyed.

The adhesive layer 10 is dried at a temperature between room temperature(25° C.) and about 80° C. for about 1 to about 5 minutes, therebyforming the adhesive sheet 11. The drying conditions of the adhesivelayer 10 are not particularly limited.

FIG. 5 is a schematic cross-sectional view showing a preferredembodiment of an adhering and peeling apparatus for bonding the adhesivelayer 10 formed on the third carrier film 9 onto the surface of theinner electrode layer 8 including the electrode layer 6 and the spacerlayer 7 formed on the second carrier film 4 and peeling off the thirdcarrier film 9 from the adhesive layer 10.

As shown in FIG. 5, the adhering and peeling apparatus according to thisembodiment includes a pair of pressure rollers 15, 16 whose temperatureis held at about 40° C. to about 100° C.

As shown in FIG. 5, the third carrier film 9 formed with the adhesivelayer 10 is fed to a portion between the pair of pressure rollers 15, 16from an obliquely upper location in such a manner that the third carrierfilm 9 is wound around part of the upper pressure roller 15 by a tensileforce applied to the third carrier film 9. On the other hand, the secondcarrier film 4 formed with the electrode layer 6 and the spacer layer 7is fed to a portion between the pair of pressure rollers 15, 16 in asubstantially horizontal direction in such a manner that the secondcarrier film 4 comes into contact with the lower pressure roller 16 andthe electrode layer 6 and the spacer layer 7 come into contact with theadhesive layer 10 formed on the third carrier film 9.

The feed rates of the second carrier film 4 and the third carrier film 9are set to 2 m/sec, for example, and the nip pressure between the pairof pressure rollers 15, 16 is preferably set between about 0.2 MPa andabout 15 MPa and more preferably between about 0.2 Mpa and about 6 Mpa.

As a result, the adhesive layer 10 formed on the third carrier film 9 isbonded to the surfaces of the electrode layer 6 and the spacer layer 7formed on the second carrier film 4.

In this embodiment, since the adhesive layer 10 is formed by coating thesurface of the third carrier film 9 with the adhesive agent solution sothat the width of the adhesive layer 10 is narrower than that of thethird carrier film 9 by 2α, even if the third carrier film 9 meanderswithin a range of a when the adhesive layer 10 is formed and even if thesecond carrier film 4 and/or the third carrier film 9 meanders within arange of a when the adhesive layer 10 is transferred onto the surface ofthe inner electrode layer 8, it is possible to reliably prevent theadhesive layer 10 from being located outside of the second carrier film4 in a widthwise direction and it is therefore possible to reliablyprevent the adhesive layer 10 from being bonded onto the surface of thetransfer roller 16.

As shown in FIG. 5, the third carrier film 9 formed with the adhesivelayer 10 is fed obliquely upward from the portion between the pair ofpressure rollers 15, 16 and the third carrier film 9 is peeled off fromthe adhesive layer 10 bonded to the electrode layer 6 and the spacerlayer 7.

When the third carrier film 9 is peeled off from the adhesive layer 10,if static charge should be generated so that dust attaches to theadhesive layer 10 and the adhesive layer 10 is attracted to thirdcarrier film 9, it would become difficult to peel off the third carrierfilm 9 from the adhesive layer 10. However, in this embodiment, theadhesive layer 10 contains an imidazoline system surfactant in an amountof 0.01 weight % to 15 weight % of the binder, so that generation ofstatic charge can be effectively prevented.

FIG. 6 shows how the adhesive layer 10 is bonded onto the surface of theinner electrode layer 8 including the electrode layer 6 and the spacerlayer 7 and formed on the second carrier film 4 and the third carrierfilm 9 is peeled off from the adhesive layer 10 and shows an ideal casewhere the adhesive layer 10 could be transferred onto the innerelectrode layer 8 while suppressing the meandering width α of each ofthe second carrier film 4 and the third carrier film 9 to zero.

As shown in FIG. 6, the adhesive layer 10 is formed so that one of theside edge portions thereof is located inside of the side edge portion ofthe second carrier film 4 by α, outside of the side edge portion of theinner electrode layer 8 by α and outside of the side edge portion of therelease layer 5 by 2α, and the adhesive layer 10 is pressed by the pairof pressure rollers 15, 16 to be bonded onto the non-surface-treatedregions 4 b on which no surface treatment for improving thereleasability of the second carrier film is performed outside of theinner electrode layer 8.

As shown in FIG. 6, the inner electrode layer 8 is also pressed by thepair of pressure rollers 15, 16 to be bonded onto thenon-surface-treated regions 4 b on which no surface treatment isperformed.

When the adhesive layer 10 has been bonded to the surfaces of theelectrode layer 6 and the spacer layer 7 formed on the second carrierfilm 4 and the third carrier film 9 has been peeled off from theadhesive layer 10 in this manner, the electrode layer 6 and the spacerlayer 7 are bonded onto the surface of the ceramic green sheet 2 formedon the first carrier film 1 via the adhesive layer 10.

FIG. 7 is a schematic cross-sectional view showing a preferredembodiment of an adhering apparatus for bonding the electrode layer 6and the spacer layer 7 onto the surface of the ceramic green sheet 2 viathe adhesive layer 10.

As shown in FIG. 7, the adhering apparatus according to this embodimentincludes a pair of pressure rollers 17, 18 whose temperature is held atabout 40° C. to about 100° C. and a slit processing machine 19downstream of the pair of pressure rollers 17, 18.

The second carrier film 4 formed with the inner electrode layer 8including the electrode layer 6, the spacer layer 7 and the adhesivelayer 10 is fed to a portion between the pair of pressure rollers 17, 18in such a manner that the second carrier film 4 comes into contact withthe upper pressure roller 17 and, on the other hand, the first carrierfilm 1 formed with the ceramic green sheet 2 is fed to the portionbetween the pair of pressure rollers 17, 18 in such a manner that thefirst carrier film 1 comes into contact with the lower pressure roller18.

In this embodiment, the pressure roller 17 is constituted as a metalroller and the pressure roller 18 is constituted as a rubber roller.

The feed rates of the first carrier film 1 and the second carrier film 4and are set to 2 m/sec, for example, and the nip pressure between thepair of pressure rollers 15, 16 is preferably set between about 0.2 MPaand about 15 MPa and more preferably between about 0.2 Mpa and about 6Mpa.

In this embodiment, the ceramic green sheet 2 and the inner electrodelayer 8 including the electrode and spacer layers 6, 7 are bonded toeach other via the adhesive layer 10 and, unlike in the conventionalprocess, they are not bonded utilizing the agglutinant forces of binderscontained in the ceramic green sheet 2, the electrode layer 6 and spacerlayer 7 or the deformation of the ceramic green sheet 2, the electrodelayer 6 and the spacer layer 7l It is therefore possible to bond theceramic green sheet 2 and the inner electrode layer 8 including theelectrode and the spacer layers 6, 7 with a low pressure such as about0.2 MPa to about 15 Mpa.

Therefore, since it is possible to prevent the ceramic green sheet 2,the electrode layer 6 and the spacer layer 7 from deforming, amulti-layered ceramic capacitor can be manufactured with high accuracyby laminating the thus formed laminated bodies including the ceramicgreen sheet 2 and the inner electrode layer 8.

Furthermore, in this embodiment, since the electrode layer 6 formed onthe second carrier film 4 is bonded onto the surface of the ceramicgreen sheet 2 via the adhesive layer 10 after the electrode layer 6 hasbeen dried, unlike in the case where the electrode layer 6 is formed byprinting an electrode paste on the surface of the ceramic green sheet 2,the electrode paste neither dissolves nor swells the binder contained inthe ceramic green sheet 2 and the electrode paste does not seep into theceramic green sheet 2. It is therefore possible to form the electrodelayer 6 on the surface of the ceramic green sheet 2.

Moreover, in this embodiment, since the adhesive layer 10 is formed bycoating the surface of the third carrier film 9 with the adhesive agentsolution so that the width of the adhesive layer 10 is narrower thanthat of the third carrier film 9 by 2α and wider than that of theceramic green sheet 2 formed on the first carrier film 1 and that of theinner electrode layer 8 formed on the second carrier film 4 by 2α, theadhesive layer 10 is securely bonded onto the non-surface-treatedregions 4 b on which no surface treatment for improving thereleasability of the second carrier film is performed outside of theinner electrode layer 8 and on the other hand, the entire surface of theceramic green sheet 2 formed on the first carrier film 1 is bonded ontothe adhesive layer 10.

After bonding the ceramic green sheet 2 and the inner electrode layer 8via the adhesive layer 10 by the pair of pressure rollers 17, 18, slitprocessing is performed by the slit processing machine 19 on the firstcarrier film 1, the ceramic green sheet 2, the adhesive layer 10, theinner electrode layer 8, the release layer 5 and the second carrier film4 located in the surface-treated region 4 a and inside of a region ofthe surface of the second carrier film 4 on which the release layer 5 isformed.

FIG. 8 is a schematic partial cross-sectional view showing how slitprocessing is performed on a laminated body obtained by bonding theceramic green sheet 2 and the inner electrode layer 8 via the adhesivelayer 10 and including the first carrier film 1, the ceramic green sheet2, the adhesive layer 10, the inner electrode layer 8, the release layer5 and the second carrier film 4 and shows an ideal case where theceramic green sheet 2 and the inner electrode layer 8 could be bonded toeach other while suppressing the meandering width a of each of the firstcarrier film 1 and the second carrier film 4 to zero.

As shown in FIG. 8, in the thus fabricated laminated body, the adhesivelayer 10 is securely bonded onto the non-surface-treated regions 4 b onwhich no surface treatment for improving the releasability of the secondcarrier film is performed outside of the inner electrode layer 8. On theother hand, the ceramic green sheet 2 is formed so that one of the sideedge portions thereof is located inside of the side edge portion of theadhesive layer 10 by α and the entire surface of the ceramic green sheet2 is bonded onto the adhesive layer 10. Further, a slit 12 is formed inthe surface-treated region 4 a inside of the release layer 5 in awidthwise direction so as to penetrate the first carrier film 1, theceramic green sheet 2, the adhesive layer 10, the inner electrode layer8, the release layer 5 and the second carrier film 4.

In this embodiment, since the slit 12 is formed in the surface-treatedregion 4 a inside of the release layer 5 in a widthwise direction so asto penetrate the first carrier film 1, the ceramic green sheet 2, theadhesive layer 10, the inner electrode layer 8, the release layer 5 andthe second carrier film 4 in this manner and portions which should notbe used for constituting a product are specified, it is possible toprevent a multi-layered unit from being erroneously cut in a subsequentstep so as to contain portions which should not be used for constitutinga product.

When the ceramic green sheet 2 formed on the first carrier film 1 hasbeen bonded onto the inner electrode layer 8 including the electrodelayer 6 and the spacer layer 7 formed on the second carrier film 4 viathe adhesive layer 10 in this manner, the first carrier film 1 is peeledoff from the ceramic green sheet 2.

In this embodiment, since the ceramic green sheet 2 is formed so thatone of side edge portions thereof is located inside of the side edgeportion of the adhesive layer 10 by α and is bonded onto the adhesivelayer 10 on the entire surface thereof and the adhesive layer issecurely bonded onto the non-surface-treated regions 4 b on which nosurface treatment for improving the releasability of the second carrierfilm is performed outside of the inner electrode layer 8, it is possibleto reliably prevent the ceramic green sheet 2 from being removedtogether with the first carrier film 1 when the first carrier film 1 ispeeled off from the ceramic green sheet 2.

Thus, a laminated body in which the release layer 5, the electrode layer6, the spacer layer 7, the adhesive layer 10 and the ceramic green sheet2 are laminated on the surface of second carrier film 4 is obtained.

Then, an adhesive layer 10 is of an adhesive sheet 11 is transferredonto the surface of the ceramic green sheet 2 similarly to the casewhere the adhesive layer 10 of the adhesive sheet 11 was transferredonto the electrode layer 6 and the spacer layer 7 formed on the secondcarrier film 4.

The thus obtained laminated body is cut to a predetermined size insideof the slit 12, thereby fabricating a multi-layered unit having apredetermined size and including the release layer 5, the electrodelayer 6, the spacer layer 7, the adhesive layer 10, the ceramic greensheet 2 and the adhesive layer 10 laminated on the surface of the secondcarrier film 4.

FIG. 9 is a schematic cross-sectional view showing multi-layered unit 20cut to a predetermined size in this manner.

As shown in FIG. 9, the multi-layered unit 20 is formed on the secondcarrier film 4 and includes the release layer 5, the electrode layer 6,the spacer layer 7, the adhesive layer 10, the ceramic green sheet 2 andthe adhesive layer 10.

Similarly to the above, release layers 5, electrode layers 6, spacerlayers 7, adhesive layers 10 and ceramic green sheets 2 are laminated onthe surfaces of other second carrier films 4 and adhesive layers aretransferred onto the ceramic green sheets 2 so as to fabricate a numberof the multi-layered units 20 each including the release layer 5, theelectrode layer 6, the spacer layer 7, the adhesive layer 10, theceramic green sheet 2 and the adhesive layer 10.

A number of the thus fabricated multi-layered units 20 are laminated viathe adhesive layer 10 transferred onto the surface of the ceramic greensheet 2 of each of the multi-layered units 20, thereby a multi-layeredceramic capacitor is manufactured.

FIG. 10 is a schematic partial cross-sectional view showing a first stepof a lamination process of the multi-layered units 20.

As shown in FIG. 10, when a number of the multi-layered units 20 are tobe laminated, a base substrate 28 is first set on a substrate 25 formedwith a number of holes 26.

As the base substrate 28, a polyethylene terephthalate film or the likeis employed.

The base substrate 28 is sucked with air via the plurality of holes 26formed in the substrate 25, thereby fixing it at a predeterminedposition on the substrate 25.

FIG. 11 is a schematic partial cross-sectional view showing a secondstep of the lamination process of the multi-layered units 20.

As shown in FIG. 11, the multi-layered unit 20 is positioned so that thesurface of the adhesive layer 10 transferred onto the surface of theceramic green sheet 2 comes into contact with the surface of the basesubstrate 28 and a pressure is applied onto the second carrier film 4 ofthe multi-layered units 20 using a pressing machine or the like.

As a result, the multi-layered unit 20 is bonded onto the base substrate28 fixed on the substrate 25 via the adhesive layer 10 transferred ontothe surface of the ceramic green sheet 2.

FIG. 12 is a schematic partial cross-sectional view showing a third stepof the lamination process of the multi-layered units 20.

When the multi-layered unit 20 has been bonded onto the base substrate28 fixed on the substrate 25 via the adhesive layer 10 transferred ontothe surface of the ceramic green sheet 2 to be laminated thereon, thesecond carrier film 4 is peeled off from the release layer 5 of themulti-layered units 20, as shown in FIG. 12.

At this time, portions of the adhesive layer 10, the inner electrodelayer 8 and the release layer 5 which were securely bonded onto thenon-surface-treated regions 4 b on which no surface treatment forimproving the releasability of the second carrier film 4 was performedhave been cut off from the multi-layered unit 20 and only the releaselayer 5 is bonded onto the surface-treated region 4 a on which surfacetreatment for improving the releasability of the second carrier film 4was performed. Therefore, it is possible to peel off only the secondcarrier film 4 from the release layer 5 in a desired manner.

Further, in this embodiment, since the electrode layer 6 and the spacerlayer 7 are formed so that ts/te is equal to 1.1, the spacer layer 7 iscompressed by the pair of pressure rollers 17, 18, not only the spacerlayer 7 but also the electrode layer 6 are bonded onto the surface ofthe ceramic green sheet 2 via the adhesive layer 10 and it is thereforepossible to effectively prevent the electrode layer 6 from being peeledoff from the ceramic green sheet 2 together with the second carrier film4 when the second carrier film 4 is peeled off.

In this manner, the new multi-layered unit 20 is further laminated onthe spacer layer 7 of the multi-layered unit 20 laminated on the basesubstrate 28 fixed onto the substrate 25 via the adhesive layer 10transferred onto the surface of the ceramic green sheet 2.

FIG. 13 is a schematic partial cross-sectional view showing a fourthstep of the lamination process of the multi-layered units 20.

As shown in FIG. 13, a new multi-layered unit 20 is positioned so thatthe surface of the adhesive layer 10 transferred onto the ceramic greensheet 2 comes into contact with the surface of the release layer 5 ofthe multi-layered unit 20 bonded onto the base substrate 28 fixed to thesubstrate 25 and pressure is applied to the second carrier film 4 of thenew multi-layered unit 20 using a pressing machine or the like.

As a result, the new multi-layered unit 20 is laminated on themulti-layered unit 20 bonded onto the base substrate 28 fixed to thesubstrate 25 via the adhesive layer 10 transferred onto the ceramicgreen sheet 2.

FIG. 14 is a schematic partial cross-sectional view showing a fifth stepof the lamination process of the multi-layered units 20.

When the new multi-layered unit 20 has been laminated on themulti-layered unit 20 bonded onto the base substrate 28 fixed to thesubstrate 25 via the adhesive layer 10 transferred onto the ceramicgreen sheet 2, the second carrier film 4 of the new multi-layered unit20 is peeled off from the release layer 5 of the multi-layered unit 20,as shown in FIG. 14.

Similarly to the above, multi-layered units 20 are sequentiallylaminated and a predetermined number of multi-layered units 20 arelaminated on the base substrate 28 fixed to the substrate 25, therebyfabricating a multi-layered block.

When a predetermined number of the multi-layered units 20 have beenlaminated on the base substrate 28 fixed to the substrate 25, therebyfabricating the multi-layered block, the multi-layered block fabricatedby laminating a predetermined number of the multi-layered units 20 onthe base substrate 28 fixed to the substrate 25 is laminated on a coverlayer of a multi-layered ceramic capacitor.

FIG. 13 is a schematic partial cross-sectional view showing a first stepof a lamination process of for laminating the multi-layered blocklaminated on the base substrate 28 fixed to the substrate 25 on thecover layer of the multi-layered ceramic capacitor.

As shown in FIG. 13, a cover layer 33 formed with an adhesive layer 10is set on a base 30 formed with a number of holes 31.

The cover layer 33 is sucked with air via the number of the holes 31formed in the base 30 and fixed at a predetermined position on the base30.

As shown in FIG. 13, the multi-layered block 40 laminated on the basesubstrate 28 sucked with air via a number of the holes 26 and fixed at apredetermined position on the substrate 25 is then positioned so thatthe surface of the release layer 5 of the last laminated multi-layeredunit 20 comes into contact with the surface of an adhesive layer 32formed on the cover layer 33.

Then, the suction operation with air via the number of the holes 26 isstopped and the substrate 25 is removed from the base substrate 28supporting the multi-layered block 40.

When the substrate 25 has been removed from the base substrate 28, apressure is applied onto the base substrate 28 using a pressing machineor the like.

As a result, the multi-layered block 40 is bonded onto the cover layer33 fixed to the base 30 via the adhesive layer 32 and laminated thereon.

FIG. 16 is a schematic partial cross-sectional view showing a secondstep of a lamination process for laminating the multi-layered block 40laminated on the base substrate 28 fixed to the substrate 25 on thecover layer 33 of the multi-layered ceramic capacitor.

When the multi-layered block 40 has been bonded via the adhesive layer32 onto the cover layer 33 fixed to the base 30 and laminated thereon,the base substrate 28 is peeled off from the adhesive layer 10 of themulti-layered block 40, as shown in FIG. 16.

In this manner, the multi-layered block 40 including a predeterminednumber of the laminated multi-layered units 20 is laminated on the coverlayer 33 fixed onto the base 30 via the adhesive layer 32.

When the multi-layered block 40 is laminated on the cover layer 33 fixedonto the base 30 via the adhesive layer 32, in accordance with the stepsshown in FIGS. 10 to 14, a new multi-layered block 40 fabricated bylaminating a predetermined number of multi-layered units 20 on the basesubstrate 28 fixed onto the base 30 is further laminated on the adhesivelayer 10 of the uppermost multi-layered unit 20 of the multi-layeredblock 40 laminated on the cover layer 33 fixed onto the base 30.

FIG. 17 is a schematic partial cross-sectional view showing a third stepof a lamination process of for laminating the multi-layered block 40laminated on the base substrate 28 fixed to the substrate 25 on thecover layer 33 of the multi-layered ceramic capacitor.

As shown in FIG. 17, the multi-layered block 40 newly laminated on thebase substrate 28 sucked with air via a number of the holes 26 and fixedat a predetermined position on the substrate 25 is positioned so thatthe surface of the release layer 5 of the last laminated multi-layeredunit 20 comes into contact with the surface of the adhesive layer 10 ofthe uppermost multi-layered unit 20 of the multi-layered block 40laminated on the cover layer 33 fixed onto the base 30.

Then, the suction operation with air via the number of the holes 26 isstopped and the substrate 25 is removed from the base substrate 28supporting the multi-layered block 40.

When the substrate 25 has been removed from the base substrate 28, apressure is applied onto the base substrate 28 using a pressing machineor the like.

As a result, the newly laminated multi-layered block 40 is bonded ontothe multi-layered block 40 laminated on the cover layer 33 fixed ontothe base 30 via the adhesive layer 10 and laminated thereon.

FIG. 18 is a schematic partial cross-sectional view showing a fourthstep of a lamination process of for laminating the multi-layered block40 laminated on the base substrate 28 fixed to the substrate 25 on thecover layer 33 of the multi-layered ceramic capacitor.

When the newly laminated multi-layered block 40 has been bonded via theadhesive layer 10 onto the multi-layered block 40 laminated on the coverlayer 33 fixed onto the base 30 and laminated thereon, the basesubstrate 28 is peeled off from the adhesive layer 10 of the newlylaminated multi-layered block 40, as shown in FIG. 18.

In this manner, the new multi-layered block 40 is bonded via theadhesive layer 10 onto the multi-layered block 40 laminated on the coverlayer 33 fixed onto the base 30 and is laminated thereon.

Similarly to the above, multi-layered blocks 40 each laminated on thebase substrate 28 fixed onto the substrate 25 are sequentially laminatedand a predetermined number of the multi-layered blocks 40, and,therefore, a predetermined number of the multi-layered units 20, arelaminated on the cover layer 33 of the multi-layered ceramic capacitor.

When a predetermined number of the multi-layered units 20 have beenlaminated on the cover layer 33 of the multi-layered ceramic capacitorin this manner, another cover layer (not shown) is bonded onto them viaan adhesive layer, thereby fabricating a laminated body including apredetermined number of the multi-layered units 20.

Then, the laminated body including the predetermined number of themulti-layered units 20 is cut to a predetermined size, therebyfabricating a number of ceramic green chips.

The thus fabricated ceramic green chips are placed in a reducing gasatmosphere so that the binder is removed therefrom and the ceramic greenchips are- baked.

Necessary external electrodes are then attached to the thus bakedceramic green chip, thereby manufacturing a multi-layered ceramiccapacitor.

According to the above described embodiment, the ceramic green sheet 2and the inner electrode layer 8 including the electrode and spacerlayers 6, 7 are bonded to each other via the adhesive layer 10 and,unlike in the conventional process, they are not bonded utilizing theagglutinant forces of binders contained in the ceramic green sheet 2,the electrode layer 6 and spacer layer 7 or the deformation of theceramic green sheet 2, the electrode layer 6 and the spacer layer 7. Itis therefore possible to bond the ceramic green sheet 2 and the innerelectrode layer 8 including the electrode and the spacer layers 6, 7with a low pressure such as about 0.2 MPa to about 15 Mpa.

Therefore, since it is possible to prevent the ceramic green sheet 2,the electrode layer 6 and the spacer layer 7 from deforming, amulti-layered ceramic capacitor can be manufactured with high accuracyby laminating the thus formed laminated bodies including the ceramicgreen sheet 2 and the inner electrode layer 8 including the electrodelayer 6 and the spacer layer 7.

Further, according to the above described embodiment, the electrodelayer 6 formed on the second carrier film 4 is bonded onto the surfaceof the ceramic green sheet 2 via the adhesive layer 10 after theelectrode layer 6 has been dried. Therefore, unlike in the case wherethe electrode layer 6 is formed by printing an electrode paste on thesurface of the ceramic green sheet 2, the electrode paste neitherdissolves nor swells the binder contained in the ceramic green sheet 2and the electrode paste does not seep into the ceramic green sheet 2. Itis therefore possible to form the electrode layer 6 on the surface ofthe ceramic green sheet 2.

Furthermore, in the above described embodiment, the surface of thesecond carrier film 4 is formed with a surface-treated region 4 a coatedwith a silicon resin, an alkyd resin or the like in order to improve thereleasability of the second carrier film 4 and non-surface-treatedregions 4 b on which no surface treatment for improving thereleasability of the second carrier film 4 is performed on both sides ofthe surface-treated region 4 a and the release layer 5 is formed bycoating the surface of the second carrier film 4 with the dielectricpaste so that the width of the release layer is narrower than the thatof the second carrier film 4 by 6α and wider than that of thesurface-treated region 4 a by 2α, and the inner electrode layer 8including the electrode layer 6 and the spacer layer 7 is formed byprinting the surface of the second carrier film with the electrode pasteand the dielectric paste so that the width of the inner electrode layeris narrower than that of the second carrier film 4 by 4 a and wider thanthat of the release layer 5 by 2α. Therefore, portions of the releaselayer 5 and the inner electrode layer 8 in the vicinity of opposite sideedge portions thereof are formed on the non-surface-treated regions 4 bon which no surface treatment for improving the releasability of thesecond carrier film is performed.

Moreover, in the above described embodiment, the adhesive layer 10 isformed by coating the surface of the third carrier film 9 with theadhesive agent solution so that the width of the adhesive layer 10 isnarrower than that of the third carrier film 9 by 2α, wider than thewidth of the ceramic green sheet 2 formed on the surface of the firstcarrier film 1 and the widths of the release layer 5 and the innerelectrode layer 8 formed on the surface of the second carrier film 4 by2α and wider than the width of the surface-treated region 4 a of thesecond carrier film 4 by 2α. When the adhesive layer 10 is transferredonto the surface of the inner electrode layer 8, the adhesive layer 10is pressed by the pair of pressure rollers 15, 16 and securely bondedonto the non-surface-treated regions 4 b on which no surface treatmentfor improving the releasability of the second carrier film is performedoutside of the inner electrode layer 8.

Further, in the above described embodiment, the ceramic green sheet 2 isformed by coating the surface of the first carrier film 1 with thedielectric paste so that the width of the ceramic green sheet 2 isnarrower than that of the first carrier film 1 by 4α and the same asthat of the inner electrode layer 8 including the electrode layer 6 andthe spacer layer 7, and when the ceramic green sheet 2 is bonded ontothe inner electrode layer 8 via the adhesive layer 10, the entiresurface of the ceramic green sheet 2 is bonded onto the adhesive layer10.

Therefore, according to the above described embodiment, since theadhesive layer 10 is formed by coating the surface of the third carrierfilm 9 with the adhesive agent solution so that the width of theadhesive layer 10 is narrower than that of the third carrier film 9 by2α, it is possible when transferring the adhesive layer 10 onto thesurface of the inner electrode layer 8 formed on the second carrier film4 to reliably prevent the adhesive layer 10 from being located outsideof the second carrier film 4 in a widthwise direction and it istherefore possible to reliably prevent the adhesive layer 10 from beingbonded onto the surface of the transfer roller 16.

Further, according to the above described embodiment, since the entiresurface of the ceramic green sheet 2 is bonded onto the adhesive layer10 securely bonded onto the non-surface-treated regions 4 b on which nosurface treatment for improving the releasability of the second carrierfilm 4 is performed outside of the inner electrode layer 8, it ispossible when peeling the first carrier film 1 off from the ceramicgreen sheet 2 to reliably prevent the ceramic green sheet 2 from beingremoved together with the first carrier film 1 and the process frombeing contaminated by the thus removed ceramic green sheet 2.

Moreover, according to the above described embodiment, after the ceramicgreen sheet 2 and the inner electrode layer 8 have been bonded to eachother via the adhesive layer 10 by the pair of pressure rollers 17, 18,slit processing is performed by the slit processing machine 19 on thefirst carrier film 1, the ceramic green sheet 2, the adhesive layer 10,the inner electrode layer 8, the release layer 5 and the second carrierfilm 4 located in the surface-treated region 4 a and inside of a regionof the surface of the second carrier film 4 on which the release layer 5is formed and portions which should not be used for constituting aproduct are specified by the slit 12. It is therefore possible toprevent a multi-layered unit from being erroneously cut in a subsequentstep so as to contain portions which should not be used for constitutinga product.

Furthermore, according to the above described embodiment, the electrodelayer 6 and the spacer layer 7 whose density is lower than that of theelectrode layer 6 and whose compression ratio is higher than that of theelectrode layer 6 are formed so that ts/te is equal to 1.1. As a result,when the electrode layer 6 and the spacer layer 7 are transferred ontothe surface of the ceramic green sheet 2 via the adhesive layer 10, thespacer layer 7 is compressed by the pair of pressure rollers 17, 18 andnot only the spacer layer 7 but also the electrode layer 6 are bondedonto the surface of the ceramic green sheet 2 via the adhesive layer 10.Therefore, it is possible to effectively prevent the electrode layer 6from being peeled off from the ceramic green sheet 2 together with thesecond carrier film 4 when the second carrier film 4 is peeled off.

Further, the third carrier film 9 would become difficult to peel offfrom the adhesive layer 10 if static charge generated in the course ofthe peeling should cause dust to attach to the adhesive layer 10 andattract the adhesive layer 10 to the third carrier film 9. However,according to the above described embodiment, generation of static chargecan be effectively prevented because the adhesive layer 10 contains animidazoline system surfactant in an amount of 0.01 weight % to 15 weight% of the binder.

The present invention has thus been shown and described with referenceto a specific embodiment. However, it should be noted that the presentinvention is in no way limited to the details of the describedarrangements but changes and modifications may be made without departingfrom the scope of the appended claims.

For example, in the above described embodiment, the laminated bodyincluding the first carrier film 1, the ceramic green sheet 2, theadhesive layer 10, the inner electrode layer 8, the release layer 5 andthe second carrier film 4 is fabricated by coating the surface of thesecond carrier film 4 with the dielectric paste so that the width of therelease layer 5 is narrower than the that of the second carrier film 4by 6α and wider than that of the surface-treated region 4 a by at least4α, thereby forming the release layer 5, printing the electrode pasteand the dielectric paste onto the surface of the second carrier film 4so that the width of the inner electrode layer 8 is narrower than thatof the second carrier film 4 by 4α and wider than that of the releaselayer 5 by 2α, thereby forming the inner electrode layer 8 including theelectrode layer 6 and the spacer layer 7, coating the surface of thefirst carrier film 1 with the dielectric paste so that the width of theceramic green sheet 2 is narrower than that of the first carrier film 1by 4α and the same as that of the inner electrode layer 8 including theelectrode layer 6 and the spacer layer 7, thereby forming the ceramicgreen sheet 2, and coating the surface of the third carrier film 9 withthe adhesive agent solution so that the width of the adhesive layer 10is narrower than the width of the third carrier film 9, wider than thewidth of the ceramic green sheet 2 formed on the surface of the firstcarrier film 1 and the widths of the release layer 5 and the innerelectrode layer 8 formed on the surface of the second support layer 4 by2α and wider than the width of the surface-treated region 4 a of thesecond carrier film 4 by 2α, thereby forming the adhesive layer 10.However, it is sufficient to fabricate the laminated body including thefirst carrier film 1, the ceramic green sheet 2, the adhesive layer 10,the inner electrode layer 8, the release layer 5 and the second carrierfilm 4 by coating the surface of the third carrier film 9 with theadhesive agent solution so that the width of the adhesive layer 10 isnarrower than the width of the third carrier film 9, wider than thewidth of the ceramic green sheet 2 formed on the surface of the firstcarrier film 1 and the widths of the release layer 5 and the innerelectrode layer 8 formed on the surface of the second support layer 4 byat least 2α and wider than the width of the surface-treated region 4 aof the second carrier film 4 by at least 2α and it is not absolutelynecessary to fabricate the laminated body including the first carrierfilm 1, the ceramic green sheet 2, the adhesive layer 10, the innerelectrode layer 8, the release layer 5 and the second carrier film 4 bycoating the surface of the second carrier film 4 with the dielectricpaste so that the width of the release layer 5 is narrower than the thatof the second carrier film 4 by 6α and wider than that of thesurface-treated region 4 a by at least 4α, thereby forming the releaselayer 5, printing the electrode paste and the dielectric paste onto thesurface of the second carrier film 4 so that the width of the innerelectrode layer 8 is narrower than that of the second carrier film 4 by4α and wider than that of the release layer 5 by 2α, thereby forming theinner electrode layer 8 including the electrode layer 6 and the spacerlayer 7, coating the surface of the first carrier film 1 with thedielectric paste so that the width of the ceramic green sheet 2 isnarrower than that of the first carrier film 1 by 4α and the same asthat of the inner electrode layer 8 including the electrode layer 6 andthe spacer layer 7, thereby forming the ceramic green sheet 2, andcoating the surface of the third carrier film 9 with the adhesive agentsolution so that the width of the adhesive layer 10 is narrower than thewidth of the third carrier film 9, wider than the width of the ceramicgreen sheet 2 formed on the surface of the first carrier film 1 and thewidths of the release layer 5 and the inner electrode layer 8 formed onthe surface of the second support layer 4 by 2α and wider than the widthof the surface-treated region 4 a of the second carrier film 4 by 2α,thereby forming the adhesive layer 10.

Further, in the above described embodiment, although the ceramic greensheet 2 and the inner electrode layer 8 are bonded to each other via theadhesive layer 10 by the pair of pressure rollers 17, 18 and slitprocessing is then performed by the slit processing machine 19 on thefirst carrier film 1, the ceramic green sheet 2, the adhesive layer 10,the inner electrode layer 8, the release layer 5 and the second carrierfilm 4 located in the surface-treated region 4 a and inside of a regionof the surface of the second carrier film 4 on which the release layer 5is formed, it is not absolutely necessary to perform slit processing onthe first carrier film 1, the ceramic green sheet 2, the adhesive layer10, the inner electrode layer 8, the release layer 5 and the secondcarrier film 4.

Furthermore, in the above described embodiment, the electrode layer 6and the spacer layer 7 are formed on the release layer 5 so that ts/teis equal to 1.1, where ts is the thickness of the spacer layer 7 and teis the thickness of the electrode layer 6. However, it is sufficient toform an electrode layer 6 and a spacer layer 7 on the release layer 5 sothat ts/te is equal to or larger than 0.7 and equal to or smaller than1.2, preferably equal to or larger than 0.8 and equal to or smaller than1.2 and more preferably equal to or larger than 0.9 and equal to orsmaller than 1.2, and it is not absolutely necessary to form theelectrode layer 6 and the spacer layer 7 on the release layer 5 so thatts/te is equal to 1.1.

Moreover, in the above described embodiment, although an imidazolinesystem surfactant is added to the adhesive agent solution, it is notabsolutely necessary to add an imidazoline system surfactant to theadhesive agent solution.

Further, in the above described embodiment, the ceramic green sheet 2 isbonded onto the surfaces of the electrode layer 6 and the spacer layer 7via the adhesive layer 10 using the adhering apparatus shown in FIG. 7and the first carrier film 1 is then peeled off from the ceramic greensheet 2. However, it is possible to bond the ceramic green sheet 2 ontothe surfaces of the electrode layer 6 and the spacer layer 7 via theadhesive layer 10 and peel off the first carrier film 1 from the ceramicgreen sheet 2 using the adhering and peeling apparatus shown in FIG. 6.

According to the present invention, it is possible to provide a methodfor manufacturing a multi-layered unit for a multi-layered ceramicelectronic component which can prevent a ceramic green sheet from beingdeformed and destroyed and prevent a solvent contained in an electrodepaste from sinking into a ceramic green sheet, thereby enablingmanufacture of a multi-layered unit including a ceramic green sheet andan electrode layer laminated to each other in a desired manner.

1. A method for manufacturing a multi-layered unit for a multi-layeredceramic electronic component comprising a step of forming a ceramicgreen sheet on the surface of a first carrier film, a step of forming arelease layer on the surface of a second carrier film including asurface-treated region on which a surface treatment is performed forimproving releasability and a non-surface-treated regions on which nosurface treatment is performed on both sides of the surface-treatedregion and having a width substantially equal to that of the firstcarrier film, a step of forming an electrode layer in a predeterminedpattern and a spacer layer in a complementary pattern to that of theelectrode layer on the surface of the release layer, thereby forming aninner electrode layer, a step of forming an adhesive layer on thesurface of a third carrier film having a width substantially equal tothat of the second carrier film, a step of bringing the surface of theadhesive layer formed on the third carrier film and the surface of theinner electrode layer into close contact with each other and pressingthem, thereby bonding the adhesive layer onto the surface of the innerelectrode layer, a step of peeling off the third carrier film from theadhesive layer, a step of pressing and bonding the ceramic green sheetformed on the surface of the first carrier film and the inner electrodelayer formed on the surface of the second carrier film onto each othervia the adhesive layer, and a step of peeling off the first carrier filmfrom the ceramic green sheet, thereby fabricating a multi-layered unitincluding the ceramic green sheet and the inner electrode layerlaminated onto each other, wherein the adhesive layer is formed bycoating the surface of the third carrier film with an adhesive agentsolution so that the width of the adhesive layer is narrower than thewidth of the third carrier film by at least 2α where α is a positivevalue, wider than the width of the ceramic green sheet formed on thesurface of the first carrier film and the widths of the release layerand the inner electrode layer formed on the surface of the secondcarrier film by at least 2α and wider than the width of thesurface-treated region of the second carrier film by at least 2α.
 2. Amethod for manufacturing a multi-layered unit for a multi-layeredceramic electronic component in accordance with claim 1, wherein theinner electrode layer is formed by printing the surface of the secondcarrier film with an electrode paste and a dielectric paste so that thewidth of the inner electrode layer is wider than that of thesurface-treated region by at least 2α.
 3. A method for manufacturing amulti-layered for a multi-layered ceramic electronic component inaccordance with claim 2, wherein the release layer is formed by coatingthe surface of the second carrier film with a dielectric paste so thatthe width of the release layer is wider than that of the surface-treatedregion by at least 2α and the inner electrode layer is formed byprinting the surface of the second carrier film with an electrode pasteand a dielectric paste so that the width of the inner electrode layer iswider than that of the release layer by at least 2α.
 4. A method formanufacturing a multi-layered for a multi-layered ceramic electroniccomponent in accordance with claim 3, wherein slit processing isperformed on the first carrier film, the ceramic green sheet, theadhesive layer, the inner electrode layer, the release layer and thethird carrier film in the surface-treated region inside of a region onwhich the release layer is to be formed by coating the surface of thesecond carrier film with the dielectric paste.
 5. A method formanufacturing a multi-layered for a multi-layered ceramic electroniccomponent in accordance with claim 1, wherein surface treatment isperformed on the surface of the first carrier film for improving thereleasability thereof and the ceramic green sheet is formed on a regionon which the surface treatment is performed.
 6. A method formanufacturing a multi-layered for a multi-layered ceramic electroniccomponent in accordance with claim 2, wherein surface treatment isperformed on the surface of the first carrier film for improving thereleasability thereof and the ceramic green sheet is formed on a regionon which the surface treatment is performed.
 7. A method formanufacturing a multi-layered for a multi-layered ceramic electroniccomponent in accordance with claim 3, wherein surface treatment isperformed on the surface of the first carrier film for improving thereleasability thereof and the ceramic green sheet is formed on a regionon which the surface treatment is performed.
 8. A method formanufacturing a multi-layered for a multi-layered ceramic electroniccomponent in accordance with claim 4, wherein surface treatment isperformed on the surface of the first carrier film for improving thereleasability thereof and the ceramic green sheet is formed on a regionon which the surface treatment is performed.
 9. A method formanufacturing a multi-layered for a multi-layered ceramic electroniccomponent in accordance with claim 1, wherein after the electrode layerwas formed on the release layer, the spacer layer is formed on therelease layer in a complementary pattern to that of the electrode layer.10. A method for manufacturing a multi-layered for a multi-layeredceramic electronic component in accordance with claim 1, wherein afterthe spacer layer was formed on the release layer in a complementarypattern to that of the electrode layer to be formed on the releaselayer, the electrode layer is formed on the release layer.
 11. A methodfor manufacturing a multi-layered for a multi-layered ceramic electroniccomponent in accordance with claim 1, wherein the adhesive layercontains dielectric particles having the same composition as that ofdielectric particles contained in the ceramic green sheet.
 12. A methodfor manufacturing a multi-layered for a multi-layered ceramic electroniccomponent in accordance with claim 1, wherein the adhesive layercontains a binder belonging to the same binder group as that a bindercontained in the ceramic green sheet belongs to.
 13. A method formanufacturing a multi-layered for a multi-layered ceramic electroniccomponent in accordance with claim 1, wherein the spacer layer containsdielectric particles having the same composition as that of dielectricparticles contained in the ceramic green sheet.
 14. A method formanufacturing a multi-layered for a multi-layered ceramic electroniccomponent in accordance with claim 1, wherein the spacer layer containsa binder belonging to the same binder group as that a binder containedin the ceramic green sheet belongs to.
 15. A method for manufacturing amulti-layered for a multi-layered ceramic electronic component inaccordance with claim 1, wherein the adhesive layer is formed so as tohave a thickness equal to or thinner than 0.1 μm.
 16. A method formanufacturing a multi-layered for a multi-layered ceramic electroniccomponent in accordance with claim 1, wherein the ceramic green sheet isformed so as to have a thickness equal to or thinner than 3 μm.
 17. Amethod for manufacturing a multi-layered for a multi-layered ceramicelectronic component in accordance with claim 1, wherein the innerelectrode layer and the adhesive layer is pressed to each other under apressure of about 0.2 MPa to about 15 Mpa.